Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures

Au-In bonding below the eutectic temperature

C.C. Lee, C.Y. Wang, G. Matijasevic · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 119 citations

Natural Sciences, Materials Engineering, Materials Science +16

Interfacial reactions between liquid indium and Au-deposited substrates

Y. M. Liu, Tung‐Han Chuang · Journal of Electronic Materials · 2000 · 73 citations

Natural Sciences, Materials Engineering, Materials Science +16

Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking

W. Zhang, Wouter Ruythooren · Journal of Electronic Materials · 2008 · 69 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +13

Gold-indium Transient Liquid Phase (TLP) wafer bonding for MEMS vacuum packaging

Warren C. Welch, Khalil Najafi · Proceedings, IEEE micro electro mechanical systems · 2008 · 57 citations

Engineering, Electrical Engineering, Materials Science +12

Wafer-level SLID bonding for MEMS encapsulation

Heng Xu, Tommi Suni, Vesa Vuorinen et al. · Advances in Manufacturing · 2013 · 44 citations · Full text

Engineering, Materials Engineering, Materials Science +14