W. Zhang

Influence of the electron mean free path on the resistivity of thin metal films

W. Zhang, Sywert Brongersma, Bert Brijs et al. · Microelectronic Engineering · 2004 · 225 citations

Materials Science, Thin Metal Films, Engineering +9

Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking

W. Zhang, Wouter Ruythooren · Journal of Electronic Materials · 2008 · 67 citations

Materials Engineering, Materials Science, 3D Ic Architecture +12

High density 20μm pitch CuSn microbump process for high-end 3D applications

Joeri De Vos, Anne Jourdain, Mehmet Akif Erişmiş et al. · 2011 · 22 citations

Engineering, Mechanical Engineering, Daisy Chains +20

Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections

W. Zhang, B. Dimcic P. Limaye, Antonio Manna et al. · 2011 · 21 citations

Engineering, Mechanical Engineering, Integrated Circuits +18

Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration

W. Zhang, Paresh Limaye, Yann Civale et al. · 2010 · 20 citations

Engineering, Mechanical Engineering, Cu Bonding Temperature +18