C.C. Lee - Concepedia

Author

C.C. Lee

University of California, Irvine

Also Known As

C.C. LEE, C.C. Lee, Chungan Lee

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

University of California, Irvine Irvine University Myongji University

About

C.C. Lee is an author at University of California, Irvine specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	20	1K
2	Applied Physics	14	17	943
3	Electrical Engineering	11	11	436
4	Computer Engineering	2	2	51
5	Chemical Engineering	1	1	20

C.C. Lee

Publications

Citations

H-Index

Page 1

	Year	Citations
A new bonding technology using gold and tin multilayer composite structures C.C. Lee, C.Y. Wang, G. Matijasevic IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringMechanical EngineeringMaterial InnovationStructural MaterialsMaterials Fabrication	1991	133
Au-In bonding below the eutectic temperature C.C. Lee, C.Y. Wang, G. Matijasevic IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringAu-in BondingMicrostructure-strength RelationshipThermophysicsThermodynamics	1993	119
Silver-indium joints produced at low temperature for high temperature devices Ricky W. Chuang, C.C. Lee IEEE Transactions on Components and Packaging Technologies Friction WeldingEngineeringMechanical EngineeringIndium LayerAdvanced Packaging (Semiconductors)	2002	119
A fluxless bonding technology using indium-silver multilayer composites Y.-C. Chen, W.W. So, C.C. Lee IEEE Transactions on Components Packaging and Manufacturing Technology Part A Materials ScienceMaterials EngineeringFluxless Bonding ProcessEngineeringFluxless Bonding Technology	1997	67
Temperature Measurement of Visible Light-Emitting Diodes Using Nematic Liquid Crystal Thermography With Laser Illumination C.C. Lee, Jungjae Park IEEE Photonics Technology Letters EngineeringJunction TemperatureThermal RadiationOptical PropertiesLed Chips	2004	65
An electrical model with junction temperature for light-emitting diodes and the impact on conversion efficiency Jeong Park, C.C. Lee IEEE Electron Device Letters EngineeringConversion EfficiencyJunction TemperatureSemiconductor DeviceNanoelectronics	2005	65
Thermal Modeling and Measurement of AlGaN–GaN HFETs Built on Sapphire and SiC Substrates Jungjae Park, Moo Whan Shin, C.C. Lee IEEE Transactions on Electron Devices Materials EngineeringWide-bandgap SemiconductorElectrical EngineeringEngineeringChip Surface	2004	56
Thermal modeling and measurement of GaN-based HFET devices Jeong Park, Moo Whan Shin, C.C. Lee IEEE Electron Device Letters Wide-bandgap SemiconductorElectrical EngineeringPamice CodeEngineeringPhysics	2003	54
Fluxless process of fabricating In-Au joints on copper substrates W.W. So, C.C. Lee IEEE Transactions on Components and Packaging Technologies Materials ScienceMaterials EngineeringFluxless ProcessBonding ProcessEngineering	2000	53
Wideband electronically tunable microwave bandstop filters using iron film-gallium arsenide waveguide structure C.S. Tsai, Jun Su, C.C. Lee IEEE Transactions on Magnetics Propagating MicrowaveElectrical EngineeringEngineeringFilter (Signal Processing)Antenna	1999	50

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