Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

Kazuhiro Nogita, Tetsuro Nishimura · Scripta Materialia · 2008 · 199 citations

Materials Science, Materials Engineering, Engineering +6

Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing

Feng Gao, Tatsuya Takemoto, Hiroshi Nishikawa · Materials Science and Engineering A · 2006 · 194 citations

Materials Engineering, Materials Science, Reactive Diffusion +7

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

L.C. Tsao, Shih‐Ying Chang · Materials & Design (1980-2015) · 2009 · 181 citations

Materials Science, Materials Engineering, Sn3.5ag0.25cu Solder +10

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

A.A. El-Daly, A.E. Hammad, A. Fawzy et al. · Materials & Design (1980-2015) · 2012 · 152 citations

Materials Science, Materials Engineering, Engineering +7

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

S.L. Tay, A.S.M.A. Haseeb, Mohd Rafie Johan et al. · Intermetallics · 2012 · 136 citations

Materials Science, Engineering, Metal Nanoparticles +8