A.S.M.A. Haseeb

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

S.L. Tay, A.S.M.A. Haseeb, Mohd Rafie Johan et al. · Intermetallics · 2012 · 136 citations

Materials Science, Engineering, Metal Nanoparticles +8

Laser-based Surface Modifications of Aluminum and its Alloys

M. M. Quazi, M.A. Fazal, A.S.M.A. Haseeb et al. · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 2015 · 122 citations

Laser-based Surface Modifications, Engineering, Mechanical Engineering +17

Friction and wear characteristics of electrodeposited nanocrystalline nickel–tungsten alloy films

A.S.M.A. Haseeb, U. Albers, Klaus J. Bade · Wear · 2007 · 106 citations

Materials Engineering, Materials Science, Engineering +5

Stability of molybdenum nanoparticles in Sn–3.8Ag–0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

A.S.M.A. Haseeb, M.M. Arafat, Mohd Rafie Johan · Materials Characterization · 2011 · 97 citations

Materials Science, Engineering, Metal Nanoparticles +8

Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

A.S.M.A. Haseeb, Tay See Leng · Intermetallics · 2011 · 91 citations

Materials Science, Engineering, Nanomaterials +7