Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing - Concepedia

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Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing

194

Citations

18

References

2006

Year

Feng Gao, Tatsuya Takemoto, Hiroshi Nishikawa

Materials Science and Engineering A

Materials EngineeringMaterials ScienceReactive DiffusionSn–3.5ag SolderEngineeringApplied PhysicsMetallurgical ProcessNi AdditionMicrostructureMetal Processing

References

	Year	Citations

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