Concepedia

Residual stresses in a pressure-sensor package induced by adhesive material during curing: a case study

Marina Santo Zarnik, D. Ročak, S. Maček

Sensors and Actuators A Physical · 2004 · 49 citations · 2 references

DOI

Concepts

References

2

Multi-physics modeling in virtual prototyping of electronic packages––combined thermal, thermo-mechanical and vapor pressure modeling

Xuejun Fan, Jiang Zhou, G.Q. Zhang · Microelectronics Reliability · 2004 · 37 citations

, , +15

Packaging technologies for pressure‐sensors

Marko Pavlin, Darko Belavič, Marina Santo Zarnik et al. · Microelectronics International · 2002 · 10 citations

, , +13