Microelectronics International · 2002 · 10 citations · 0 references
Materials ScienceAdvanced PackagingSensor ApplicationEngineeringSensorsMicrofabricationHigh‐density PackagingMechanical EngineeringActive PackagingPressure VesselSensor DesignElectronic PackagingInstrumentationPressure‐sensor MiniaturizationSensor TechnologyPressure Switch
Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor.