Concepedia

Miniaturized Packaging

Miniaturized Packaging is a type of biosensor packaging that integrates downscaled, compact structural design and advanced materials to enable reduced device footprint while maintaining or enhancing functional performance, environmental protection, and signal integrity in biomedical and point-of-care applications.

23

Publications

999

Citations

124

Authors

36

Institutions

Publications per year

2017–2026

4

Parents

Publications

23

Vacuum packaging for microsensors by glass-silicon anodic bonding

Hiroshi Henmi, S. Shoji, Y. Shoji et al. · Sensors and Actuators A Physical · 1994 · 230 citations

, , +14

The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade

Rao Tummala, Madhavan Swaminathan, Manos M. Tentzeris et al. · IEEE Transactions on Advanced Packaging · 2004 · 152 citations

, , +15

Miniature stick-packaging – an industrial technology for pre-storage and release of reagents in lab-on-a-chip systems

Thomas van Oordt, Yannick Barb, Jan Smetana et al. · Lab on a Chip · 2013 · 97 citations

, , +14

SAW devices and their wireless communications applications

C.C.W. Ruppel, Leonhard Reindl, Robert Weigel · IEEE Microwave Magazine · 2002 · 87 citations

, , +16

Micromachined packaging for chemical microsensors

R. L. Smith, Scott D. Collins · IEEE Transactions on Electron Devices · 1988 · 54 citations

, , +16

1–5 of 23

Authors

124

  1. DP
    D.D. Polityko

    Fraunhofer Institute for Reliability and Microintegration, Germany

    1 publications · 20 citations

    1

    h-index

  2. FV
    Felix von Stetten

    University of Freiburg, Germany

    1 publications · 97 citations

    1

    h-index

  3. YB
    Yannick Barb

    University of Freiburg, Germany

    1 publications · 97 citations

    1

    h-index

  4. SO
    S. Ono

    Nitto Chemical Industry (Japan), Japan

    1 publications · 11 citations

    1

    h-index

  5. WJ
    William J. Chappell

    Purdue University West Lafayette, United States

    1 publications · 15 citations

    1

    h-index

1–5 of 124

Institutions

36

  1. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    3 h-index

    12 publications

    281 citations

  2. Fraunhofer-Gesellschaft

    Munich, Germany

    2 h-index

    3 publications

    83 citations

  3. Technische Universität Berlin

    Berlin, Germany

    2 h-index

    9 publications

    190 citations

  4. University of Ljubljana

    Ljubljana, Slovenia

    1 h-index

    5 publications

    50 citations

  5. Massachusetts Institute of Technology

    Cambridge, United States

    1 h-index

    1 publications

    54 citations

  6. Université Grenoble Alpes

    Saint-Martin-d'Hères, France

    1 h-index

    5 publications

    80 citations

  7. Cornell University

    Ithaca, United States

    1 h-index

    1 publications

    14 citations

  8. Queen's University Belfast

    Belfast, United Kingdom

    1 h-index

    2 publications

    70 citations

1–8 of 36

Venues

  1. European Microelectronics and Packaging Conference

    Conference · 2 publications · 31 citations

    2

    h-index

  2. IEEE Transactions on Electron Devices

    2 publications · 82 citations

    2

    h-index

  3. IEEE Microwave Magazine

    1 publications · 87 citations

    1

    h-index

  4. Sensors and Actuators B Chemical

    1 publications · 35 citations

    1

    h-index

  5. IEEE Nanotechnology Magazine

    1 publications · 14 citations

    1

    h-index

1–5