The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

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Reliability challenges in 3D IC packaging technology

K. N. Tu · Microelectronics Reliability · 2010 · 636 citations

Engineering, Manufacturing Engineering, Electronic Materials +13

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

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Engineering, Materials Engineering, Materials Science +16

Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

Matthew Kerr, Nikhilesh Chawla · Acta Materialia · 2004 · 218 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders

W. T. Chen, Cheng–En Ho, C. R. Kao · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 210 citations

Engineering, Materials Engineering, Materials Science +14