Impact of X-Ray Exposure on a Triple-Level-Cell NAND Flash

Abstract

The total ionizing dose response of a triple-level-cell (TLC) NAND flash is shown to be low enough that data corruption can occur as a result of an x-ray inspection. Only a few seconds of x-ray exposure corresponding to a total dose of merely 50 rad(Si) in a real-time x-ray source are required to induce errors. An in-depth total dose analysis shows which pages of the memory and data patterns are the most susceptible to radiation. The results show that TLC NAND flash devices are not suitable for use in high radiation environments, and that care must be taken when exposing them to even small x-ray exposures like those present in a circuit board inspection.