Concepedia

The influence of addition elements on the early resistance changes observed during electromigration testing of Al metal lines

W.A De Ceuninck, V. D’Haeger, J. Van Olmen, Ann Witvrouw, Karen Maex, L. De Schepper, Peter De Pauw, A Pergoot

Microelectronics Reliability · 1998 · 10 citations · 11 references

DOI

Concepts

References

11

Constitution of Binary Alloys

Max Hansen, K. Anderko, H. W. Salzberg · Journal of The Electrochemical Society · 1958 · 14.8K citations

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Electromigration—A brief survey and some recent results

J. R. Black · IEEE Transactions on Electron Devices · 1969 · 1.5K citations

, , +17

Activation energy spectra and relaxation in amorphous materials

M.R.J. Gibbs, J. E. Evetts, J.A. Leake · Journal of Materials Science · 1983 · 455 citations

, , +11

Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses

M. A. Korhonen, P. Bo rgesen, D. D. Brown et al. · Journal of Applied Physics · 1993 · 102 citations

, , +17

A model for the effect of line width and mechanical strength on electromigration failure of interconnects with “near-bamboo” grain structures

Eduard Arzt, W.D. Nix · Journal of materials research/Pratt's guide to venture capital sources · 1991 · 90 citations · Full text

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