On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages

Abstract

Theoretical and practical ranges of leak rates measurable by the helium mass spectrometer are characterized. The effect of noise due to: 1) background helium present in the spectrometer and 2) desorption of helium that attaches itself to the specimen surface during bombing is quantified experimentally. The results guide a framework to extract the true leak rate from the measured leak rate profile. An optical interferometry based hermeticity measurement technique for ultra-fine leaks is proposed. The setup to implement the technique is described and a preliminary experimental result is reported.