Arindam Goswami

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Active since

2008

Affiliations

Life Cycle Engineering (United States)(Current)

University of Maryland, College Park

Arindam Goswami is an author at Life Cycle Engineering (United States) specializing in materials science, leak assessment, and leak detection in packaging.

ORCID

Publications per year

2008–2009

Publications

On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages

Arindam Goswami, Bongtae Han · IEEE Transactions on Advanced Packaging · 2008 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +14

Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis

Changsoo Jang, Arindam Goswami, Bongtae Han · Journal of Microelectromechanical Systems · 2009 · 10 citations

Engineering, Materials Science, Mechanical Engineering +17

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