2004 · 10 citations · 3 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsMicrofabricationSemiconductor DevicesMemory DevicesMemristive MaterialsCopper MetallizationElectrical Resistance DistributionMagnetoresistive Random-access MemoryMemory Circuit DesignMemristive MemoryMetallizationNon-volatile Memory DesignNonvolatile Memory
This paper discusses the fabrication of a 2 Kb array test chip with a 1.66 /spl mu/m/sup 2/ cell and a corresponding 128 Kb MRAM (Magnetoresistive Random Access Memory) with a 1.4 /spl mu/m/sup 2/ cell. The technology features a 1 transistor 1 MTJ (Magnetic Tunnel Junction) cell in a 0.18 /spl mu/m, 3 level Cu metallization logic-based process. Outlined here is a yield analysis of the read operation, which is governed by the MTJ resistance distribution function and a systematic study of the write operation. MRAM functionality, with a checkerboard disturb pattern, was obtained after process optimization. Write endurance tests did not show degradation of the cell properties.
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W. Reohr, H. Honigschmid, R. P. Robertazzi et al. · IEEE Circuits and Devices Magazine · 2002 · 74 citations
Natural Sciences, Computer Engineering, Materials Science +16
Nonvolatile RAM based on magnetic tunnel junction elements
M. Durlam, P. Naji, M. DeHerrera et al. · 2002 · 62 citations
Natural Sciences, Electrical Engineering, Materials Science +17