A 0.18 μm logic-based MRAM technology for high performance nonvolatile memory applications

A. R. Sitaram, David W. Abraham, C. Alof, Daniel Braun, S. Brown, G. Costrini, F. Findeis, M. C. Gaidis, E. Galligan, W. Glashauser,

2004 · 10 citations · 3 references

Concepts

Abstract

This paper discusses the fabrication of a 2 Kb array test chip with a 1.66 /spl mu/m/sup 2/ cell and a corresponding 128 Kb MRAM (Magnetoresistive Random Access Memory) with a 1.4 /spl mu/m/sup 2/ cell. The technology features a 1 transistor 1 MTJ (Magnetic Tunnel Junction) cell in a 0.18 /spl mu/m, 3 level Cu metallization logic-based process. Outlined here is a yield analysis of the read operation, which is governed by the MTJ resistance distribution function and a systematic study of the write operation. MRAM functionality, with a checkerboard disturb pattern, was obtained after process optimization. Write endurance tests did not show degradation of the cell properties.

References

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