Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits

Thin Films—Interdiffusion and Reactions

J. M. Poate, K. N. Tu, Jean-Claude Mayor et al. · Journal of The Electrochemical Society · 1979 · 1.7K citations

Materials Science, Thin Film Physics, Engineering +9

Intergranular fracture at elevated temperature

Rishi Raj, Michael F. Ashby · Acta Metallurgica · 1975 · 837 citations

Materials Science, Skeletal Trauma, Engineering +7

Stress evolution due to electromigration in confined metal lines

M. A. Korhonen, P. Bo rgesen, K. N. Tu et al. · Journal of Applied Physics · 1993 · 724 citations

Engineering, Back Stresses, Chip Level +19

Homogeneous nucleation and growth of droplets in vapours

J. Feder, K.C. Russell, J. Lothe et al. · Advances In Physics · 1966 · 663 citations

A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2

M. Shatzkes, J. R. Lloyd · Journal of Applied Physics · 1986 · 301 citations

Electrical Engineering, Electromigration Technique, Engineering +15