Concepedia

Publication | Open Access

Through-silicon via based 3D IC technology: Electrostatic simulations for design methodology

Full Paper Access

29

Citations

8

References

2008

Year

Maxime Rousseau, O. Rozeau, G. Cibrario, G. Le Carval, Marie-Anne Jaud, Patrick Leduc, A. Farcy, A. Marty
HAL (Le Centre pour la Communication Scientifique Directe)

Abstract

International audience

References

YearCitations

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