Concepedia

Package Substrate Design

Package Substrate Design is a specialized engineering framework that defines the structural and electrical layout of the interconnect layers within a microelectronic package to enable signal transmission, power distribution, and mechanical support between a semiconductor die and the printed circuit board.

22

Publications

588

Citations

113

Authors

24

Institutions

Publications per year

2017–2026

2

Parents

Publications

22

Recent Advances and New Trends in Flip Chip Technology

John H. Lau · Journal of Electronic Packaging · 2016 · 150 citations

, , +13

Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

Yonggang Wang, Guangneng Zhang, Jusheng Ma · Materials Science and Engineering B · 2002 · 74 citations

, , +14

11.1 A Scalable Heterogeneous Integrated Two-Stage Vertical Power-Delivery Architecture for High-Performance Computing

Casey Hardy, Hieu Pham, Mohamed Mehdi Jatlaoui et al. · 2023 · 33 citations

, , +17

<formula formulatype="inline"><tex Notation="TeX">$W$</tex> </formula>-Band Bandpass Filter Using Micromachined Air-Cavity Resonator With Current Probes

Sangsub Song, Chan‐Sei Yoo, Kwang-Seok Seo · IEEE Microwave and Wireless Components Letters · 2010 · 33 citations

, , +17

Effect of surfactant on package substrate in chemical mechanical planarization

Soocheon Jang, Haedo Jeong, Minjong Yuh et al. · International Journal of Precision Engineering and Manufacturing-Green Technology · 2015 · 32 citations · Full text

, , +12

1–5 of 22

Authors

113

  1. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    2 publications · 30 citations

    2

    h-index

  2. FL
    Fuhan Liu

    Georgia Institute of Technology, United States

    2 publications · 30 citations

    2

    h-index

  3. AH
    A. Hasan

    Intel (United States), United States

    2 publications · 25 citations

    2

    h-index

  4. CN
    Chandrasekharan Nair

    Georgia Institute of Technology, United States

    1 publications · 19 citations

    1

    h-index

  5. YL
    Yulan Lu

    Chinese Academy of Sciences, China

    1 publications · 24 citations

    1

    h-index

1–5 of 113

Institutions

24

  1. Intel (United States)

    Santa Clara, United States

    3 h-index

    16 publications

    220 citations

  2. IBM (United States)

    Armonk, United States

    2 h-index

    3 publications

    51 citations

  3. Panasonic (Japan)

    Kadoma, Japan

    2 h-index

    6 publications

    86 citations

  4. Georgia Institute of Technology

    Atlanta, United States

    2 h-index

    10 publications

    158 citations

  5. Tokyo Ohka Kogyo (Japan)

    Kawasaki, Japan

    1 h-index

    1 publications

    19 citations

  6. Nanyang Technological University

    Singapore, Singapore

    1 h-index

    3 publications

    45 citations

  7. Seoul National University

    Seoul, South Korea

    1 h-index

    2 publications

    66 citations

  8. Tsinghua University

    Beijing, China

    1 h-index

    3 publications

    222 citations

1–8 of 24

Venues

  1. IEEE Transactions on Advanced Packaging

    3 publications · 48 citations

    3

    h-index

  2. Microelectronics Reliability

    1 publications · 15 citations

    1

    h-index

  3. IBM Journal of Research and Development

    1 publications · 18 citations

    1

    h-index

  4. Microelectronic Engineering

    1 publications · 24 citations

    1

    h-index

  5. Computer

    1 publications · 17 citations

    1

    h-index

1–5