Chandrasekharan Nair

Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost

Brett Sawyer, Yuya Suzuki, Ryuta Furuya et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 45 citations

Engineering, Device Integration, Laser Ablation +18

Design, Modeling, Fabrication and Characterization of 2–5-<inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math> </inline-formula> Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers

Hao Lü, Ryuta Furuya, Brett Sawyer et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 42 citations

Optical Materials, Engineering, Device Integration +23

Heterogeneous integration for artificial intelligence: Challenges and opportunities

Saibal Mukhopadhyay, Yin Long, Burhan Ahmad Mudassar et al. · IBM Journal of Research and Development · 2019 · 37 citations

Artificial Intelligence, Hardware Security, Engineering +15

“zero-undercut” semi-additive copper patterning - a breakthrough for ultrafine-line RDL lithographic structures and precision RF thinfilm passives

P. Markondeya Raj, Chandrasekharan Nair, Hao Lü et al. · 2015 · 25 citations

Innovative Sub-5-$\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects

Fuhan Liu, Gaurav Khurana, Rui Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 21 citations

Optical Materials, Engineering, First Time Microvias +26