Ryuta Furuya

Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost

Brett Sawyer, Yuya Suzuki, Ryuta Furuya et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 45 citations

Engineering, Device Integration, Laser Ablation +18

Design, Modeling, Fabrication and Characterization of 2–5-<inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math> </inline-formula> Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers

Hao Lü, Ryuta Furuya, Brett Sawyer et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 42 citations

Optical Materials, Engineering, Device Integration +23

Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-Fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs

Fuhan Liu, Atsushi Kubo, Chandrasekharan Nair et al. · 2016 · 13 citations

Engineering, Line Width, Integrated Circuits +20

Demonstration of 2µm RDL wiring using dry film photoresists and 5µm RDL via by projection lithography for low-cost 2.5D panel-based glass and organic interposers

Ryuta Furuya, Hao Lü, Fuhan Liu et al. · 2015 · 11 citations

Engineering, Device Integration, Optoelectronic Devices +21

Demonstration of 10-<inline-formula> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>m Microvias in Thin Dry-Film Polymer Dielectrics for High-Density Interposers

Yuya Suzuki, Ryuta Furuya, Venky Sundaram et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 11 citations

Zeonif Zs100, Engineering, Polymer Dielectric +18