Concepedia

Cavity Packaging

Cavity Packaging is a MEMS packaging configuration in which a void or enclosed space is intentionally created above the microelectromechanical device to protect sensitive components while enabling physical interaction with the environment.

41

Publications

1.7K

Citations

183

Authors

51

Institutions

Publications per year

2017–2026

3

Parents

Publications

41

Wafer level packaging of MEMS

Masayoshi Esashi · Journal of Micromechanics and Microengineering · 2008 · 353 citations

, , +17

Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails

Eva Rajo‐Iglesias, Ashraf Uz Zaman · IEEE Microwave and Wireless Components Letters · 2009 · 186 citations

, , +16

Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices

Anne Jourdain, Piet De Moor, Sayanu Pamidighantam et al. · 2003 · 105 citations

, , +17

Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices

Anne Jourdain, Piet De Moor, Kris Baert et al. · Journal of Micromechanics and Microengineering · 2005 · 86 citations

, , +16

Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

H.A.C. Tilmans, H. Ziad, Henri Jansen et al. · 2002 · 74 citations

, , +16

1–5 of 41

Authors

183

  1. AJ
    Anne Jourdain

    IMEC, Belgium

    4 publications · 308 citations

    4

    h-index

  2. HT
    H.A.C. Tilmans

    IMEC, Belgium

    4 publications · 308 citations

    4

    h-index

  3. ME
    Masayoshi Esashi

    Tohoku University, Japan

    3 publications · 396 citations

    3

    h-index

  4. NS
    N. Sillon

    Commissariat à l'Énergie Atomique et aux Énergies Alternatives, France

    2 publications · 31 citations

    2

    h-index

  5. PC
    P.L. Charvet

    Laboratoire d'Électronique des Technologies de l'Information, France

    2 publications · 38 citations

    2

    h-index

1–5 of 183

Institutions

51

  1. IMEC

    Leuven, Belgium

    5 h-index

    42 publications

    2.1K citations

  2. Tohoku University

    Sendai, Japan

    4 h-index

    9 publications

    572 citations

  3. University of Michigan

    Ann Arbor, United States

    3 h-index

    6 publications

    114 citations

  4. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    3 h-index

    15 publications

    248 citations

  5. Laboratoire d'Électronique des Technologies de l'Information

    Grenoble, France

    3 h-index

    15 publications

    248 citations

  6. CEA Grenoble

    Grenoble, France

    3 h-index

    15 publications

    248 citations

  7. KU Leuven

    Leuven, Belgium

    3 h-index

    8 publications

    240 citations

  8. Southeast University

    Nanjing, China

    2 h-index

    12 publications

    132 citations

1–8 of 51

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 5 publications · 541 citations

    5

    h-index

  2. Microsystem Technologies

    3 publications · 65 citations

    3

    h-index

  3. 2

    h-index

  4. IEEE Microwave and Wireless Components Letters

    1 publications · 186 citations

    1

    h-index

  5. IEEE Transactions on Advanced Packaging

    1 publications · 41 citations

    1

    h-index

1–5