Concepedia

Bump Testing

Bump Testing is a procedural validation method within suspension system analysis that distinguishes itself by assessing dynamic responsiveness through controlled mechanical impacts to evaluate energy dissipation characteristics under transient loading conditions.

29

Publications

722

Citations

130

Authors

56

Institutions

Publications per year

2017–2026

4

Parents

Publications

29

Numerical and experimental investigation of bump foil mechanical behaviour

Alejandro Cerda Varela, Ilmar F. Santos · Tribology International · 2014 · 64 citations

, , +11

Evaluation of TSV and micro-bump probing for wide I/O testing

Ken R. Smith, Peter Hanaway, Mike Jolley et al. · 2011 · 57 citations

, , +14

The kicking machine: A device for impact testing of structural components

A.G. Hanssen, T. Auestad, Tore Tryland et al. · International Journal of Crashworthiness · 2003 · 43 citations

, , +17

Experimental and numerical investigation of the effect of a speed bump on car noise emission level

Mehdi Behzad, Mohammad Hodaei, Iraj Alimohammadi · Applied Acoustics · 2006 · 40 citations

, , +16

Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Young-Doo Jeon, Kyung‐Wook Paik, A. Ostmann et al. · Journal of Electronic Materials · 2005 · 40 citations

, , +17

1–5 of 29

Authors

130

  1. JH
    Jui-Hsiung Huang

    National Taiwan University of Science and Technology, Taiwan

    2 publications · 73 citations

    2

    h-index

  2. EJ
    Erik Jan Marinissen

    IMEC, Belgium

    2 publications · 73 citations

    2

    h-index

  3. PC
    Pei-Chen Chang

    Industrial Technology Research Institute, Taiwan

    2 publications · 73 citations

    2

    h-index

  4. RL
    Robert Lo

    Industrial Technology Research Institute, Taiwan

    2 publications · 73 citations

    2

    h-index

  5. TC
    Tao‐Chih Chang

    Industrial Technology Research Institute, Taiwan

    2 publications · 73 citations

    2

    h-index

1–5 of 130

Institutions

56

  1. Industrial Technology Research Institute

    Hsinchu, Taiwan

    3 h-index

    31 publications

    1.1K citations

  2. IMEC

    Leuven, Belgium

    2 h-index

    7 publications

    317 citations

  3. University of Notre Dame

    Notre Dame, United States

    2 h-index

    5 publications

    111 citations

  4. Electronics and Telecommunications Research Institute

    Daejeon, South Korea

    2 h-index

    10 publications

    200 citations

  5. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    2 h-index

    4 publications

    102 citations

  6. ITRI International

    San Jose, United States

    2 h-index

    17 publications

    611 citations

  7. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    2 h-index

    3 publications

    91 citations

  8. Sharif University of Technology

    Tehran, Iran

    1 h-index

    2 publications

    80 citations

1–8 of 56

Venues

  1. Journal of Electronic Materials

    JEM · 2 publications · 51 citations

    2

    h-index

  2. Microelectronics Reliability

    2 publications · 28 citations

    2

    h-index

  3. 2

    h-index

  4. 1

    h-index

  5. Structure and Infrastructure Engineering

    1 publications · 14 citations

    1

    h-index

1–5