Aspect Ratio Dependent Etching

Aspect Ratio Dependent Etching is a plasma etching phenomenon in semiconductor manufacturing where the etch rate decreases with increasing aspect ratio of the feature being etched, primarily due to restricted reactant transport and ion flux in high-aspect-ratio structures.

242

Publications

10.3K

Citations

843

Authors

220

Institutions

Publications per year

2017–2026

35

Variants

Arde

Authors

843

  1. MJ
    Mark J. Kushner

    University of Illinois Urbana-Champaign, United States

    10 publications · 589 citations

    10

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  2. DJ
    Demetre J. Economou

    University of Houston, United States

    5 publications · 424 citations

    5

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  3. OJ
    O. Joubert

    Centre National de la Recherche Scientifique, France

    5 publications · 221 citations

    5

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  4. CM
    Chad M. Huard

    University of Michigan, United States

    5 publications · 369 citations

    5

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  5. GS
    G. S. Oehrlein

    University of Maryland, College Park, United States

    5 publications · 237 citations

    5

    h-index

1–5 of 843

Venues

  1. 21

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  2. 21

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  3. Japanese Journal of Applied Physics

    JJAP · 20 publications · 563 citations

    16

    h-index

  4. Journal of The Electrochemical Society

    JES · 16 publications · 821 citations

    14

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  5. Applied Physics Letters

    9 publications · 524 citations

    9

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1–5