Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation

Shuo Huang, Chad M. Huard, Seung‐Bo Shim, +4

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Ar/c4f8/o2 MixturesEngineeringAbundant FluxesIntegrated CircuitsChemistry +19

Photo–Roll Lithography (PRL) for Continuous and Scalable Patterning with Application in Flexible Electronics

Jong G. Ok, Moon Kyu Kwak, Chad M. Huard, +2

Advanced Materials

Atomic layer etching of 3D structures in silicon: Self-limiting and nonideal reactions

Chad M. Huard, Yiting Zhang, Saravanapriyan Sriraman, +3

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Ar/cl2 PlasmasEngineeringElectron-beam LithographyAtomic Layer EtchingSilicon On Insulator +20

Transient behavior in quasi-atomic layer etching of silicon dioxide and silicon nitride in fluorocarbon plasmas

Chad M. Huard, Saravanapriyan Sriraman, Alex Paterson, +1

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

EngineeringPolymer OverlayerAtomic Layer EtchingSilicon On InsulatorPlasma Processing +20

Highly stable and stretchable graphene–polymer processed silver nanowires hybrid electrodes for flexible displays

Qi Zhang, Yanfei Di, Chad M. Huard, +3

Journal of Materials Chemistry C

Materials ScienceFlexible Graphene–polymerElectrical EngineeringGraphene NanomeshesEngineering +13

Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features

Chad M. Huard, Yiting Zhang, Saravanapriyan Sriraman, +2

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

EngineeringPlasma PhysicsPlasma ProcessingPlasma ElectronicsTransport Phenomena +16

Abnormal Multiple Charge Memory States in Exfoliated Few-Layer WSe₂ Transistors

Mikai Chen, Yifan Wang, Nathan Shepherd, +5

ACS Nano

ITO‐Free, Compact, Color Liquid Crystal Devices Using Integrated Structural Color Filters and Graphene Electrodes

Jinbao Guo, Chad M. Huard, Yang Yang, +3

Advanced Optical Materials

Optical MaterialsEngineeringElectronic DevicesOptical PropertiesOnline Delivery +15

Investigation of feature orientation and consequences of ion tilting during plasma etching with a three-dimensional feature profile simulator

Yiting Zhang, Chad M. Huard, Saravanapriyan Sriraman, +3

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Plasma ElectronicsEngineeringPhysicsMicrofabricationNatural Sciences +12

Consequences of atomic layer etching on wafer scale uniformity in inductively coupled plasmas

Chad M. Huard, Steven J. Lanham, Mark J. Kushner

Journal of Physics D Applied Physics

EngineeringElectron-beam LithographyWafer Scale UniformityVacuum DeviceSilicon On Insulator +14