Alex Paterson

Frequency dependent plasma characteristics in a capacitively coupled 300 mm wafer plasma processing chamber

Gregory A. Hebner, Edward V. Barnat, Paul Miller et al. · Plasma Sources Science and Technology · 2006 · 90 citations

Electrical Engineering, Line-integrated Electron Density, Engineering +9

Spatial and frequency dependence of plasma currents in a 300 mm capacitively coupled plasma reactor

Paul Miller, Edward V. Barnat, Gregory A. Hebner et al. · Plasma Sources Science and Technology · 2006 · 66 citations

Electrical Engineering, Plasma Reactor, Engineering +14

Atomic layer etching of 3D structures in silicon: Self-limiting and nonideal reactions

Chad M. Huard, Yiting Zhang, Saravanapriyan Sriraman et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2017 · 64 citations

Ar/cl2 Plasmas, Engineering, Electron-beam Lithography +22

Transient behavior in quasi-atomic layer etching of silicon dioxide and silicon nitride in fluorocarbon plasmas

Chad M. Huard, Saravanapriyan Sriraman, Alex Paterson et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2018 · 64 citations

Engineering, Polymer Overlayer, Atomic Layer Etching +22

Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features

Chad M. Huard, Yiting Zhang, Saravanapriyan Sriraman et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2017 · 60 citations · Full text

Engineering, Plasma Physics, Plasma Processing +18