Statistics
Publications
7
Citations
325
H-Index
7
Active since
2018
Zhong Cheng is an author at Hong Kong University of Science and Technology specializing in engineering, chip packaging, and packaging engineering.
Publications per year
2018–2018
7
7
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Cheng-Ta Ko, Chieh-Lin Chang, Jhih-Yuan Pan et al. · 2018 · 35 citations
Engineering, Electrical Engineering, Materials Engineering +17
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