Concepedia

Thiam Beng Lim

TB

Statistics

Publications

13

Citations

335

H-Index

11

Active since

1989

Affiliations

Institute of Microelectronics(Current)

National University of Singapore

The University of Sydney

Georgia Institute of Technology

University of Technology Sydney

Thiam Beng Lim is an author at Institute of Microelectronics specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMaterial ScienceMicroelectronicsElectrical EngineeringThermal EngineeringMechanics Of MaterialsHeat TransferThermodynamics

Publications per year

1989–2008

13

Publications

13

Moisture diffusion and vapour pressure modeling of IC packaging

E.H. Wong, Yong‐Chua Teo, Thiam Beng Lim · 2002 · 98 citations

Moisture Diffusion, Engineering, Food Packaging +22

Chemical Modification of Silicon (100) Surface via UV-Induced Graft Polymerization

Junfeng Zhang, Cheng Cui, Thiam Beng Lim et al. · Chemistry of Materials · 1999 · 34 citations

Advances in Vapor Pressure Modeling for Electronic Packaging

E.H. Wong, Sau Koh, K.H. Lee et al. · IEEE Transactions on Advanced Packaging · 2006 · 34 citations

Materials Science, Chip-scale Package, Engineering +14

MODELING OF WHOLE FIELD VAPOR PRESSURE DURING REFLOW FOR FLIP CHIP BGA AND WIRE BOND PBGA PACKAGES

Tong Yan Tee, Xuejun Fan, Thiam Beng Lim · 1999 · 29 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

Analytical Solutions for Interconnect Stress in Board Level Drop Impact

E.H. Wong, Yiu‐Wing Mai, S.K.W. Seah et al. · IEEE Transactions on Advanced Packaging · 2007 · 28 citations

Engineering, Impact (Mechanics), Impact Loading +18

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