T.Y. Lin

Novel Cu-to-Cu Bonding With Ti Passivation at 180$^{\circ}{\rm C}$ in 3-D Integration

Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng et al. · IEEE Electron Device Letters · 2013 · 104 citations

Novel Cu-to-cu Bonding, Engineering, Inner Cu +18

The evaluation of copper migration during the die attach curing and second wire bonding process

T.Y. Lin, Michael Pecht, Diganta Das et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 17 citations

Engineering, Die Attach Curing, Mechanical Engineering +17

Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages

T.Y. Lin, K.L. Davison, Wei Sun Leong et al. · Microelectronics Reliability · 2003 · 15 citations

Materials Engineering, Materials Science, Surface Topographical Characterization +10

The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method

T.Y. Lin, Wei Sun Leong, K.H. Chua et al. · Microelectronics Reliability · 2002 · 14 citations

Materials Engineering, Materials Science, Chemical Engineering +11

Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

Yu-San Chien, Yan-Pin Huang, Ruoh-Ning Tzeng et al. · IEEE Transactions on Electron Devices · 2014 · 12 citations

High Thermal Stability, Engineering, Device Integration +22