T.Y. Lin - Concepedia

Author

T.Y. Lin

Also Known As

T. Lin, T.Y. Lin, Teu-Hua Lin

Publications

192

Citations

H-Index

Concepts

All Affiliations

T.Y. Lin is an author at Institute of Materials Research and Engineering specializing in engineering, materials engineering, and materials science.

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	162
2	Materials Engineering	5	5	162
3	Applied Physics	3	3	133
4	Electrical Engineering	2	2	116
5	Chemical Engineering	1	1	14

T.Y. Lin

Publications

162

Citations

H-Index

Page 1

	Year	Citations
Novel Cu-to-Cu Bonding With Ti Passivation at 180$^{\circ}{\rm C}$ in 3-D Integration Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, IEEE Electron Device Letters Novel Cu-to-cu BondingEngineeringInner CuIntegrated CircuitsInterconnect (Integrated Circuits)	2013	104
The evaluation of copper migration during the die attach curing and second wire bonding process T.Y. Lin, Michael Pecht, Diganta Das, IEEE Transactions on Components and Packaging Technologies EngineeringDie Attach CuringMechanical EngineeringCorrosionSilver Surface	2005	17
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages T.Y. Lin, K.L. Davison, Wei Sun Leong, Microelectronics Reliability Materials EngineeringMaterials ScienceSurface Topographical CharacterizationWedge BondabilityEngineering	2003	15
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method T.Y. Lin, Wei Sun Leong, K.H. Chua, Microelectronics Reliability Materials EngineeringMaterials ScienceChemical EngineeringElectromigration TechniqueX-ray Spectroscopy	2002	14
Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration Yu-San Chien, Yan-Pin Huang, Ruoh-Ning Tzeng, IEEE Transactions on Electron Devices High Thermal StabilityEngineeringDevice IntegrationInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2014	12

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