Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages - Concepedia

Concepedia

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Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages

15

Citations

5

References

2003

Year

T.Y. Lin, K.L. Davison, Wei Sun Leong, Simon Chua, Y.F. Yao, Jisheng Pan, J. W. Chai, K.C. Toh, Wuiwui Chauhari Tjiu

Microelectronics Reliability

Materials EngineeringMaterials ScienceSurface Topographical CharacterizationWedge BondabilityEngineeringSurface CharacterizationMechanical EngineeringSurface ScienceSurface TreatmentElectronic PackagingSurface ProcessingThin Film ProcessingLeaded Ic Packages

References

	Year	Citations

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