Yan-Pin Huang

Publications

222

Citations

H-Index

2013

Active since

Affiliations

National Yang Ming Chiao Tung University(Current)

Advanced Semiconductor Engineering (Taiwan)

Yan-Pin Huang is an author at National Yang Ming Chiao Tung University specializing in materials engineering, electrical engineering, and microelectronics.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsMaterials EngineeringElectrical EngineeringSurface ScienceAdvanced PackagingThree-dimensional Heterogeneous IntegrationNanoelectronics

Publications per year

2013–2020

Publications

Novel Cu-to-Cu Bonding With Ti Passivation at 180$^{\circ}{\rm C}$ in 3-D Integration

Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng et al. · IEEE Electron Device Letters · 2013 · 104 citations

Novel Cu-to-cu Bonding, Engineering, Inner Cu +18

Demonstration and Electrical Performance of Cu–Cu Bonding at 150 °C With Pd Passivation

Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng et al. · IEEE Transactions on Electron Devices · 2015 · 92 citations

Engineering, Electrical Performance, Integrated Circuits +17

Low Temperature Cu/SiO2 Hybrid Bonding with Metal Passivation

Demin Liu, Po-Chi Chen, Chien-Kang Hsiung et al. · 2020 · 14 citations

Engineering, Short Duration, Silicon On Insulator +19

Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

Yu-San Chien, Yan-Pin Huang, Ruoh-Ning Tzeng et al. · IEEE Transactions on Electron Devices · 2014 · 12 citations

High Thermal Stability, Engineering, Device Integration +22

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