2020 · 15 citations · 1 references
Natural SciencesMaterials EngineeringMaterials ScienceCeramic MaterialsElectronic MaterialsMetallic MaterialsCeramic BondingHybrid MaterialsMetallic BondingMetalsWafer BondingBondingBonding Temperature EffectsContact ResistanceLow-temperature BondingLow-temperature MaterialsMechanical StrengthMechanical Strength Testing
Cu/SiO2 hybrid bonding process with short duration (1 minute) has been successfully performed at low temperature (120 °C) under the atmosphere with metal passivation material. Electrical performance (over 15K daisy chain and 10−8 Ω-cm2 specific contact resistance), mechanical strength (>15kgf), and reliability have been conducted to verify its excellent bonding quality. This method of hybrid bonding therefore provides a wide range of applications and a new solution for 3D integration.
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