Glen Mori

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Active since

2010

Affiliations

Applied Materials (United States)(Current)

Glen Mori is an author at Applied Materials (United States) specializing in interconnect technology, 3d integrated circuits, and electrical engineering.

Publications per year

2010–2020

Publications

Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation

Niranjan Kumar, Sesh Ramaswami, John Dukovic et al. · 2012 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

Through-silicon-via technology for 3D integration

John Dukovic, S. Ramaswami, Sharma Pamarthy et al. · 2010 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

Low Temperature Cu/SiO2 Hybrid Bonding with Metal Passivation

Demin Liu, Po-Chi Chen, Chien-Kang Hsiung et al. · 2020 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +15

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