Concepedia

Publication | Closed Access

The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method

DOI

14

Citations

6

References

2002

Year

T.Y. Lin, Wei Sun Leong, K.H. Chua, Reum Oh, Yuanhao Miao, Jisheng Pan, J. W. Chai
Microelectronics Reliability

References

YearCitations

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