Sayoon Kang

Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

Yoshikuni Nakadaira, Seyoung Jeong, Jongbo Shim et al. · Microelectronics Reliability · 2008 · 54 citations

Materials Engineering, Materials Science, Engineering +6

Fine pitch chip interconnection technology for 3D integration

Ji-Hwan Hwang, Jongyeon. Kim, Woon‐Seong Kwon et al. · 2010 · 51 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +15

Modeling and experimental studies on thermosonic flip-chip bonding

Sayoon Kang, Paul M. Williams, Yung-Cheng Lee · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 50 citations

Engineering, Mechanical Engineering, Thermosonic Wire Bonding +20

Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder

Bo‐In Noh, Jeong‐Won Yoon, Kwang‐Seok Kim et al. · Microelectronic Engineering · 2012 · 30 citations

Materials Science, Chemical Engineering, Engineering +7

Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process

Sayoon Kang, Hong Xie, Y. C. Lee · Journal of Electronic Packaging · 1993 · 26 citations

Engineering, Mechanical Engineering, Smart Manufacturing +21