Concepedia

Y. C. Lee

YC

6

Publications

151

Citations

6

H-Index

1991

Active since

Affiliations

University of Colorado Boulder(Current)

Y. C. Lee is an author at University of Colorado Boulder specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringRefrigerationThermodynamicsMaterial ScienceIndustrial Design

Publications per year

1991–2024

6

Publications

6

Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint

Susant K. Patra, Y. C. Lee · Journal of Electronic Packaging · 1991 · 56 citations

Materials Science, Industrial Design, Self-alignment Mechanism +15

Quantitative Characterization of a Flip-Chip Solder Joint

Susant K. Patra, S. S. Sritharan, Y. C. Lee · Journal of Applied Mechanics · 1995 · 28 citations

Industrial Design, Engineering, Advanced Packaging (Semiconductors) +9

Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process

Sayoon Kang, Hong Xie, Y. C. Lee · Journal of Electronic Packaging · 1993 · 26 citations

Engineering, Mechanical Engineering, Smart Manufacturing +21

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Dylan P. McNally, Ryan Lewis, Y. C. Lee · Journal of Electronic Packaging · 2018 · 15 citations

Thin Vapor Chambers, Engineering, Pillar Permeability +13

First Demonstration of Monolithic CFET Inverter at 48nm Gate Pitch Toward Future Logic Technology Scaling

Siyong Liao, Wei-Xiang You, Ting Wu et al. · 2024 · 15 citations

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