Jongbo Shim is an author at Samsung (South Korea) specializing in mechanical engineering, engineering, and materials science.
Top concepts
EngineeringMaterial ScienceMechanical EngineeringCorrosionMineral ProcessingMaterials EngineeringAllergyMedicineVirologyImmunology
Publications per year
2002–2011
4
4
Mechanisms of die and underfill cracking in flip chip PBGA package
Jongbo Shim, Eun-Chul Ahn, Tae-Je Cho et al. · 2002 · 18 citations
Rows per page
1–4 of 4