Eun-Chul Ahn

Laser Dicing and Subsequent Die Strength Enhancement Technologies for Ultra-thin Wafer

Jianhua Li, Hyeon Jun Hwang, Eun-Chul Ahn et al. · 2007 · 44 citations

Engineering, Mechanical Engineering, Laser Ablation +20

Cohesive failure of the Cu/polyimide system

I.S. Park, Eun-Chul Ahn, Jin Yu et al. · Materials Science and Engineering A · 2000 · 22 citations

Materials Engineering, Materials Science, Engineering +4

Mechanisms of die and underfill cracking in flip chip PBGA package

Jongbo Shim, Eun-Chul Ahn, Tae-Je Cho et al. · 2002 · 18 citations

Materials Science, Chip-scale Package, Engineering +15

Reliability of flip chip BGA package on organic substrate

Eun-Chul Ahn, Tae-Je Cho, Ho-Joong Moon et al. · 2002 · 11 citations

Reliability, Materials Science, Reliability Engineering +13

Improvement of drop reliability in OSP/Cu pad finished packages

Pyoungwan Kim, Bo Seong Kim, Eun-Chul Ahn et al. · 2006 · 10 citations