Kripesh Vaidyanathan

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · IEEE Transactions on Advanced Packaging · 2009 · 295 citations

Engineering, Materials Engineering, Materials Science +16

Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · 2008 · 96 citations

Engineering, Materials Engineering, Materials Science +16

Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Gong Yue Tang, S. P. Tan, Navas Khan et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 59 citations

Engineering, Mechanical Engineering, Heat Transfer +15

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 55 citations

Engineering, Electrical Engineering, Electronic Materials +16

A novel method to predict die shift during compression molding in embedded wafer level package

Chee Houe Khong, Aditya Kumar, Xiaowu Zhang et al. · 2009 · 52 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +13