Carlos Fonseca

High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

P. Agnello, T. Ivers, C. Warm et al. · 2006 · 115 citations

Engineering, Vlsi Design, Enhanced Strain +21

High-performance circuit design for the RET-enabled 65-nm technology node

Lars W. Liebmann, Arnold E. Barish, Zachary M. C. Baum et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2004 · 52 citations

Low-power Electronics, Electrical Engineering, Mask Lithography +15

Optimum tone for various feature types: positive versus negative

Timothy A. Brunner, Carlos Fonseca · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2001 · 30 citations

Psychoacoustics, Engineering, Electron-beam Lithography +19

Immersion lithography: New opportunities for semiconductor manufacturing

Timothy A. Brunner, Carlos Fonseca, Nakgeuon Seong et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2004 · 30 citations

Materials Science, Engineering, Electron-beam Lithography +15

Impact of resist blur on MEF, OPC, and CD control

Timothy A. Brunner, Carlos Fonseca, Nakgeuon Seong et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2004 · 26 citations

Electrical Engineering, Engineering, Electron-beam Lithography +7