K. H. Teo

Stress evolution in surrounding silicon of Cu-filled through-silicon via undergoing thermal annealing by multiwavelength micro-Raman spectroscopy

Woocheol Kwon, D. T. Alastair, K. H. Teo et al. · Applied Physics Letters · 2011 · 75 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +20

Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers

Fa Xing, H.Y. Li, Xiaowu Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 70 citations

Engineering, Mechanical Engineering, Wafer Stress +21

Wafer level warpage modeling methodology and characterization of TSV wafers

H. Y. Li, Xiaowu Zhang, Shan Gao et al. · 2011 · 26 citations

Materials Engineering, 3D Ic Architecture, Electrical Engineering +14

The study of thermo-mechanical reliability for multi-layer stacked chip module with through-silicon-via (TSV)

Xiaowu Zhang, Navas Khan, K. H. Teo et al. · 2010 · 14 citations

Engineering, Mechanical Engineering, Chip Module +19

A self-contained disposable cartridge microsystem for dengue viral ribonucleic acid extraction

Li Zhang, Siti Mohamed Rafei, Ling Xie et al. · Sensors and Actuators B Chemical · 2011 · 12 citations

Medicine, Virology, Microbiology +3