Tae-Gyeong Chung

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology

Uksong Kang, Hoeju Chung, Seongmoo Heo et al. · IEEE Journal of Solid-State Circuits · 2010 · 484 citations

3D Ic Architecture, Electrical Engineering, Engineering +12

Laser Dicing and Subsequent Die Strength Enhancement Technologies for Ultra-thin Wafer

Jianhua Li, Hyeon Jun Hwang, Eun-Chul Ahn et al. · 2007 · 44 citations

Engineering, Mechanical Engineering, Laser Ablation +20

An Auger study on the interaction of Cu and Cr films with polyimide

Tae-Gyeong Chung, Young‐Ho Kim, Jin Yu · Journal of Adhesion Science and Technology · 1994 · 20 citations

Engineering, Metal/polyimide Interfaces, Auger Study +19

Mechanisms of die and underfill cracking in flip chip PBGA package

Jongbo Shim, Eun-Chul Ahn, Tae-Je Cho et al. · 2002 · 18 citations

Materials Science, Chip-scale Package, Engineering +15

Improvement of drop reliability in OSP/Cu pad finished packages

Pyoungwan Kim, Bo Seong Kim, Eun-Chul Ahn et al. · 2006 · 10 citations