S.H. Wang

A 3nm CMOS FinFlex™ Platform Technology with Enhanced Power Efficiency and Performance for Mobile SoC and High Performance Computing Applications

Shien-Yang Wu, M.C. Chiang, C.Y. Lin et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 56 citations

Engineering, Electrical Engineering, High-performance Computing +17

A highly manufacturable 28nm CMOS low power platform technology with fully functional 64Mb SRAM using dual/tripe gate oxide process

Shien-Yang Wu, J.J. Liaw, Chih‐Yung Lin et al. · Symposium on VLSI Technology · 2006 · 42 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 90 nm CMOS MS/RF based foundry SOC technology comprising superb 185 GHz f/sub T/ RFMOS and versatile, high-Q passive components for cost/performance optimization

C.H. Chen, Chia-He Chang, C.P. Chao et al. · 2004 · 29 citations

Engineering, Electrical Engineering, Microelectronics +16

A 32nm CMOS Low Power SoC Platform Technology for Foundry Applications with Functional High Density SRAM

Shien-Yang Wu, Chung-Cheng Chou, C.Y. Lin et al. · 2007 · 19 citations

Engineering, Computer Engineering, Electrical Engineering +16

An ultra-thin interposer utilizing 3D TSV technology

W.C. Chiou, K.F. Yang, J.L. Yeh et al. · 2012 · 15 citations

Engineering, Electrical Engineering, Materials Science +17