Jürgen Wolf

3D System Integration Technologies

Peter Ramm, Armin Klumpp, R. Merkel et al. · MRS Proceedings · 2003 · 53 citations

Geometric Modeling, 3D Ic Architecture, Engineering +9

Characteristics of fritting contacts utilized for micromachined wafer probe cards

Toshihiro Itoh, Tadatomo Suga, Gunter Engelmann et al. · Review of Scientific Instruments · 2000 · 19 citations

Engineering, Mechanical Engineering, Microactuator +17

Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration

Iuliana Panchenko, Steffen Bickel, Jörg Meyer et al. · Japanese Journal of Applied Physics · 2017 · 19 citations

Engineering, Fine-pitch Interconnects, Integrated Circuits +20

Design and Comparison of 24 GHz Patch Antennas on Glass Substrates for Compact Wireless Sensor Nodes

Florian Ohnimus, Uwe Maaß, Gerhard Fotheringham et al. · International Journal of Microwave Science and Technology · 2010 · 16 citations · Full text

Millimeter Wave Technology, Engineering, Compact 24 +13

The correction factors and their new curve for the measurement of sheet resistance of a square sample with a square four-point probe

Yicai Sun, O. Ehrmann, Jürgen Wolf et al. · Review of Scientific Instruments · 1992 · 15 citations

Square Sample, Electrical Engineering, Engineering +15