Kwang-Yoo Byun

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 487 citations

Engineering, Electrical Engineering, Circuit Theory +16

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 166 citations

Engineering, Computer Engineering, Electrical Engineering +17

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Suk-Kyu Ryu, Tengfei Jiang, Kuan Lu et al. · Applied Physics Letters · 2012 · 115 citations

Engineering, Materials Engineering, Materials Science +17

Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Suk-Kyu Ryu, Qiu Zhao, M. Hecker et al. · Journal of Applied Physics · 2012 · 111 citations

Engineering, Materials Engineering, Materials Science +17

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Hae-A-Seul Shin, Byoung‐Joon Kim, Ju-Heon Kim et al. · Journal of Electronic Materials · 2012 · 72 citations

Engineering, Materials Engineering, Materials Science +17