K. P. Chang

Electromigration Lifetime Improvement of Copper Interconnect by Cap/Dielectric Interface Treatment and Geometrical Design

Ming‐Hsien Lin, Y.L. Lin, J.M. Chen et al. · IEEE Transactions on Electron Devices · 2005 · 53 citations

Engineering, Electrical Engineering, Materials Engineering +17

Effects of width scaling and layout variation on dual damascene copper interconnect electromigration

M.H. Lin, K. P. Chang, K. C. Su et al. · Microelectronics Reliability · 2006 · 30 citations

Engineering, Electrical Engineering, Materials Science +16

Multi-Level Operation of Fully CMOS Compatible WOX Resistive Random Access Memory (RRAM)

Wei-Chih Chien, Y. C. Chen, K. P. Chang et al. · 2009 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +15

Copper Interconnect Electromigration Behavior in Various Structures and Precise Bimodal Fitting

M.H. Lin, Y.L. Lin, K. P. Chang et al. · Japanese Journal of Applied Physics · 2006 · 23 citations

Engineering, Electrical Engineering, Materials Engineering +17

A study of the switching mechanism and electrode material of fully CMOS compatible tungsten oxide ReRAM

Wei-Chih Chien, Y. C. Chen, Erh-Kun Lai et al. · Applied Physics A · 2011 · 22 citations

Engineering, Materials Engineering, Materials Science +16