Ming‐Hsien Lin

Statistics

Publications

Citations

412

H-Index

Active since

1993

Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)(Current)

University of Wisconsin–Madison

National Yang Ming Chiao Tung University

Taiwan Semiconductor Manufacturing Company (United States)

Ming‐Hsien Lin is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in electrical engineering, engineering, and electromigration.

ORCID

Publications per year

1993–2021

Publications

Electromigration Failure Distributions of Cu/Low-$k$ Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology

A. S. Oates, Ming‐Hsien Lin · IEEE Transactions on Device and Materials Reliability · 2009 · 55 citations

Engineering, Electrical Engineering, Materials Science +17

Electromigration Lifetime Improvement of Copper Interconnect by Cap/Dielectric Interface Treatment and Geometrical Design

Ming‐Hsien Lin, Y.L. Lin, J.M. Chen et al. · IEEE Transactions on Electron Devices · 2005 · 53 citations

Engineering, Electrical Engineering, Materials Engineering +17

A Right-Half-Plane Zero-Free Buck-Boost DC-DC Converter with 97.46% High Efficiency and Low Output Voltage Ripple

Yen-An Lin, Tzu-Ping Huang, You-Zheng Ou-Yang et al. · 2019 · 44 citations

Engineering, Electrical Engineering, Internet Of Things +13

The scaling of electromigration lifetimes

A. S. Oates, Ming‐Hsien Lin · 2012 · 29 citations

Engineering, Electrical Engineering, Materials Science +15

An Electromigration Failure Distribution Model for Short-Length Conductors Incorporating Passive Sinks/Reservoirs

Ming‐Hsien Lin, A. S. Oates · IEEE Transactions on Device and Materials Reliability · 2013 · 23 citations

Engineering, Electrical Engineering, Materials Science +17

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