K. C. Su

Electromigration Lifetime Improvement of Copper Interconnect by Cap/Dielectric Interface Treatment and Geometrical Design

Ming‐Hsien Lin, Y.L. Lin, J.M. Chen et al. · IEEE Transactions on Electron Devices · 2005 · 53 citations

Engineering, Interconnect (Integrated Circuits), Electromigration Lifetime Improvement +18

Effects of width scaling and layout variation on dual damascene copper interconnect electromigration

M.H. Lin, K. P. Chang, K. C. Su et al. · Microelectronics Reliability · 2006 · 29 citations

Electrical Engineering, Width Scaling, Engineering +10

Copper Interconnect Electromigration Behavior in Various Structures and Precise Bimodal Fitting

M.H. Lin, Y.L. Lin, K. P. Chang et al. · Japanese Journal of Applied Physics · 2006 · 23 citations

Engineering, Precise Bimodal Fitting, Interconnect (Integrated Circuits) +17

Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment

M.H. Lin, Y.L. Lin, K. P. Chang et al. · Microelectronics Reliability · 2004 · 18 citations

Materials Science, Materials Engineering, Electrical Engineering +14

A High Precision, Wide Dynamic Range Closed-Loop Neuromodulation IC With Rapid Stimulation Artifact Recovery

Zhang Qiu, Anh Tuan Nguyen, K. C. Su et al. · IEEE Transactions on Biomedical Circuits and Systems · 2023 · 14 citations