Motoshi Ono

Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Vijay Sukumaran, Tapobrata Bandyopadhyay, Qiao Chen et al. · 2011 · 83 citations

Engineering, Materials Engineering, Materials Science +17

Development of Through Glass Via (TGV) formation technology using electrical discharging for 2.5/3D integrated packaging

Shintaro Takahashi, Kohei Horiuchi, Kentaro Tatsukoshi et al. · 2013 · 78 citations

Engineering, Materials Engineering, Materials Science +12

Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

Yoichiro Sato, Srikrishna Sitaraman, Vijay Sukumaran et al. · 2013 · 29 citations

Engineering, Electrical Engineering, Materials Science +17

Development of TGV Interposer for 3D IC

Shintaro Takahashi, Kentaro Tatsukoshi, Motoshi Ono et al. · IMAPSource Proceedings · 2013 · 11 citations

Engineering, Materials Engineering, Materials Science +16

Development of High Frequency Device Using Glass or Fused Silica with 3D Integration

Shintaro Takahashi, Yoichiro Sato, Kohei Horiuchi et al. · 2017 · 10 citations

Engineering, Electrical Engineering, Materials Engineering +17