Mieko Suzuki

Tradeoff Characteristics Between Resistivity and Reliability for Scaled-Down Cu-Based Interconnects

Shinji Yokogawa, Kuniko Kikuta, Hideaki Tsuchiya et al. · IEEE Transactions on Electron Devices · 2008 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

A Robust Embedded Ladder-Oxide/Cu Multilevel Interconnect Technology for 0.13 µm Complementary Metal Oxide Semiconductor Generation

Noriaki Oda, S. Ito, T. Takewaki et al. · Japanese Journal of Applied Physics · 2007 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +17

Time-Dependent Dielectric Breakdown Characterization of 90- and 65-nm-Node Cu/SiOC Interconnects with Via Plugs

Kazuyoshi Ueno, Akiko Kameyama, Akira Matsumoto et al. · Japanese Journal of Applied Physics · 2007 · 11 citations

Engineering, Electrical Engineering, Materials Science +17

A Fully Planarized Multilevel Interconnection Technology Using Semi‐Selective Tetraethoxysilane‐Ozone Chemical Vapor Deposition at Atmospheric Pressure

Tetsuya Homma, Mieko Suzuki, Yukinobu Murao · Journal of The Electrochemical Society · 1993 · 10 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17