T. Takewaki

Electrical Properties of Giant‐Grain Copper Thin Films Formed by a Low Kinetic Energy Particle Process

T. Nitta, Tadahiro Ohmi, M. Otsuki et al. · Journal of The Electrochemical Society · 1992 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +17

Tradeoff Characteristics Between Resistivity and Reliability for Scaled-Down Cu-Based Interconnects

Shinji Yokogawa, Kuniko Kikuta, Hideaki Tsuchiya et al. · IEEE Transactions on Electron Devices · 2008 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

Formation of giant-grain copper interconnects by a low-energy ion bombardment process for high-speed ULSIs

T. Takewaki, Hirohito Yamada, T. Shibata et al. · Materials Chemistry and Physics · 1995 · 17 citations

Engineering, Materials Engineering, Materials Science +13

CMOS device optimization for system-on-a-chip applications

Kazuo Imai, Koji Yamaguchi, Tomoaki Kudo et al. · 2002 · 15 citations

Engineering, Computer Engineering, Electrical Engineering +17

A novel self-aligned surface-silicide passivation technology for reliability enhancement in copper interconnects

T. Takewaki, T. Ohmi, T. Nitta · 2002 · 12 citations

Engineering, Materials Engineering, Materials Science +15